Summary of features of boiling heat transfer

Summary Cathepsin G Inhibitor I features of boiling heat transfer enhancement surfaces fabricated using MEMS/NEMS techniques.Refs.Base surface materialFabrication techniquesGeometries of surfacesFluids for boiling tests[117]Si waferDry etchingRectangular micro-pin–fin-structuredFC-72[119]CopperDry etching by irradiating heavy ions and electrolytic processMicro-pin–fin-structuredR141b[121]CopperDry etching by irradiating heavy ions and electrolytic processInclined micro-pin–fin-structuredR134a and FC-3284[122]Si waferDry etchingMicro-pin–fin-structuredPF-5060[123]Si waferPhotolithography and wet etchingMicro-pin–fin-structuredWater[124]Si waferWet etching and nanorod growth by dipping into solutionMicro/nano/multiscaledWater[125]Si waferDRIEMicrochannels, notches at channel sidewalls and offset strip finsWater[126]Si waferDRIE and immersing into solutionMicronano hybrid structured–[127] and [128]Si waferDRIE and immersing into solutionMicronano hybrid structuredWater[35]Si waferDRIEMicropillar-arrayedWater[129]Si waferDry etching with inductively coupled plasmaRectangular micro-pin–fin-structuredWater[130]Si waferBosch etching and deep ultraviolet photographyRidge structures with heights of protozoa hundreds of nanometersWater[131]Si waferDry etching and wet etchingMicropillar-, microcavity-, nanowire-, and nanocavity-structuredEthanolFull-size tableTable optionsView in workspaceDownload as CSV