Cooke and Kandlikar fabricated various microchannel structures on Si wafer

Summary CID 2011756 features of boiling heat transfer enhancement surfaces fabricated using chemical processes.Refs.Base surface materialsFabrication techniqueGeometry of surfacesFluid for boiling tests[104]Si waferChemical etchingRectangular channel arrays with pore structures in trapezoidal shapeFC-72[46]CopperPhotolithographyMicrogroovedWater[105]Si waferEENanowire-arrayedWater[107]Aluminum alloy (6061)AnodizationNanoporous structureWater[108]Aluminum alloy (6061)AnodizationThree-dimensionally interconnected sponge-like nephridium porous structureWater[109], [110], [111] and [112]Zircaloy-4AnodizationMicro/nanoscale structureWater[114]Ag–Si, Au–glass, and Cu substratesElectrochemical deposition technique using AAO membraneNanowire-arrayedWater[115]Si waferMetal particle-assisted electroless chemical etchingNanowire-arrayedWater[116]Si wafer deposited with Ti Cu and Au thin filmsMetal particle-assisted electroless chemical etchingNanowire-arrayedPF-5060Full-size tableTable optionsView in workspaceDownload as CSV