3.4. Fracture surface observation
Fig.?5. SEM micrographs of fracture surface of AZ505 Mg alloy after different processes: (a) SS, (b) SS + 16P ECAP, (c and d) 16P ECAP + RT rolling, (e) 16P ECAP + 673 K rolling and (f) 16P ECAP + 773 K rolling.Figure optionsDownload full-size imageDownload as PowerPoint slide
AcknowledgementsThis work was supported by National Natural Science Foundation of China (Grant No. 51141002), Jiangsu Provincial Natural Science Foundation of China (Grant No. BK20131373) and the Opening Project of Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology (Grant No. ASMA201404).
Diffusion bonding; Magnesium (Mg); Aluminum (Al); Growth kinetics; Intermetallic phases; Interdiffusion
The difficulty when joining Mg and Al is the formation of high hardness and brittleness intermetallic compounds (IMCs). By using vacuum diffusion bonding the development of solidification cracking and high distortion stresses can be avoided, compared to conventional welding technique. However, the formations of IMCs at the joints limit the performances . These IMCs act preferentially as the source of cracks when they grow to a certain size . To achieve the maximum strength, it is essential to have complete control the growth of IMCs over the relevant process parameters.