pcb material for Effects of Printed Circuit Board

Effects of Printed Circuit Board Printed circuit board complexity has been a main challenge of the majority of electronics companies as they try to get the most competitive product to market quicker and cheaper. There are several factors that are contributing to complexity of cheap printed circuit board manufacturing.

1. In the last ten years, the number of leads per square inch has tripled. However the board area has remained the same.

2. In the last fifteen years, there has been an increase in the use of few, high pin-count parts used with passive components. This has changed the average number of components to quadruple while leads-per-part average has decreased 4-5 times.

3. The number of pin-to-pin connections has doubled and the number of pins in a design has tripled.

While complexity has been a major challenge, the other challenges to advanced printed circuit boards technologies are because of the increases in IC speeds and densities.

1. Strict design rules must match the proportion of high-speed interconnects.

2. Thermal management challenges: As speeds and densities of IC increases the heat they dissipate also increases. The problem is compounded when ICs are put into smaller forms.

3. The change to ICs running at multiple supply voltages. Gone are the days were ICs could be run on a single +5V.

4. Printed circuit board designers can't keep up with manufacturability. Manufacturing rule sets have become so extensive it's beyond the comprehension of the average designer.

What to do?

Tools need to keep up with the advanced technologies of printed circuit boards and ICs in order to meet productivity and time constraints. These are the capabilities needed in today's tools.

1. Get more pins at smaller spacing through a 2 step process. You'll want to automate the process of connecting the surface of BGA pads to the inner layers of the PCB, as well as connecting the inner-layer to rest of the components on the PCB. If this process is done manually it could take the designer days.

2. Pre-analyze the high speed net classes and create constraints for those interconnects. The first reason for this step is necessary because of the increases in IC density and performance that affect PCB design. Boards with many constrained interconnects provides the productivity and accuracy to create the right board on the first try. The second reason for this step is to provide adequate heat dissipation to its extremities. The third reason for this step is the requirement of supporting multiple, low-tolerance voltages.

The design team productivity and rate at which products hit the market are compromised by advances in PCB and IC technology. To overcome these challenges electronic companies have been wise to use best practices within the industry. The main way around this is using the PCB design tools that have kept up with these advances. Using current design tools allows the automation needed to help designers stay productive, http://pcbonline.qsite.dk/171889/Working%20With%20Creo, http://pcbonline.2349057.n4.nabble.com/ChipChecker-com-For-Quality-And-Commitment-td14.html %20The%20New%203D%20CAD%20Software produce the items that keeps the company competitive in a timely manner that keeps cost low.

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