Sinofast high frequency PCB boards are widely used in wireless networks, wireless communications and satellite communications. In particular, the popularity of 3G, 4G, 5G networks greatly increases the market demand for Bluetooth PCB.
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies is required to meet the social market. It has also become more and more necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Base material: FR-4/ FR-1/ FR-2/ CEM-1/CEM-3, Aluminum, Metal based
Layer count: 2-18
Thickness of finished panel: 0.20mm - 4.0mm
Board Thickness Tolerance: ±10%
Inner layer/Outer layer Base Cooper thickness: 0.5 OZ(17 um)/ 0.5 OZ(17 um)
Impedance tolerance: ±10%
Impedance Control: 50Ω
Warp & Twist: ≤0.5%
Peel strength of line: ≥61 B/in (≥107g/mm)
Outer layer line width (a): 0.075mm (3 mil)
Outer layer line space(b): 0.075mm (3 mil)
Image to image tolerance: ±0.075mm (±3 mil)
SMD pitch (a): 0.2 mm(8 mil)
BGA pitch (b): 0.2 mm (8 mil)
Thickness of solder mask (line end): 0.4-1.2 mil
Thickness of solder mask (line corner): ≥0.2 mil
Hardness of solder mask: 6 H
Solder mask registration tolerance: ±2 mil
Min drilling diameter: 0.15 mm
Min diameter of finished hole: 0.10 mm
Tolerance of PTH diameter: ±2mil (± 50um)
Tolerance of NPTH diameter: ±1mil (± 25um)
Choosing a circuit material for a high-frequency PCB board is generally a trade-off, often between price and performance. But PCB materials are also selected by two key factors: how well they meet the needs of an end-use application and what kind of effort is required to fabricate a desired circuit with a particular material.
SinoFast processes high-frequency materials with improved dielectric properties. These have a very low loss factor, low dielectric constant, and are frequency independent.
For some special high-frequency PCB materials, such as: printed circuit boards material, Rogers PCB materials, we also have the production ability.